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課程名稱 |
半導體電子產品工程
Semiconductor Electronic Product Engineering |
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開課學期 |
111-2 |
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授課對象 |
電機資訊學院 電機工程學研究所 |
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授課教師 |
潘正聖 |
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課號 |
EEE5054 |
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課程識別碼 |
943 U0560 |
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班次 |
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學分 |
3.0 |
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全/半年 |
半年 |
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必/選修 |
選修 |
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上課時間 |
星期三6,7,8(13:20~16:20) |
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上課地點 |
電二141 |
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備註 |
總人數上限：12人 |
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課程簡介影片 |
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核心能力關聯 |
核心能力與課程規劃關聯圖 |
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課程大綱
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為確保您我的權利,請尊重智慧財產權及不得非法影印
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課程概述 |
Semiconductor electronic product engineering techniques, covering knowledge in process, device, circuit design, test, Q/R etc., as well as the teamwork among domain specialists to drive for product success. |
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課程目標 |
1. Product engineering is to ensure product characteristics meeting specifications and classify individual unit accordingly.
2. If there is any product behavior failing specification, product engineer must understand the failure root cause and identify/implement solution by collaborating with device/process, design, testing, and quality/reliability.
3. Technical background is very broad covering from process, device and design, since product failure may be caused by any anomaly in either design or process/device. Solutions may come from both sides.
4. The key performance index of product engineering is yield, which is tied closely to business success.
In short, product engineering requires multi-disciplinary knowledge in order to be successful |
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課程要求 |
需有電子學、半導體製程或半導體元件物理等相關基礎 |
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預期每週課後學習時數 |
數小時 |
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Office Hours |
另約時間 備註： 課業諮詢方式: 請學生先和老師確定線上諮詢時間，不限次數。 |
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指定閱讀 |
Digital Integrated Circuits: A Design Perspective, 2nd edition by Jan M. Rabaey |
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參考書目 |
VLSI Technology, 2nd edition by S. Sze
Physics of Semiconductor Devices, 2nd edition by S. Sze
VLSI Test Principles and Architectures, edited by LT Wang, CW Wu and XQ Wen, 2006 **
System on Chip Test Architectures, edited by LT Wang, CE Stroud and NA Touba, 2008 **
Applied Reliability, 3rd edition by P. Tobias
Reliability Physics and Engineering, 2nd edition by J. W. McPerson
Intel Quality Handbook, 2014 **
Renesas Semiconductor Reliability Handbook, 2017 |
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評量方式
(僅供參考) |
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No. |
項目 |
百分比 |
說明 |
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1. |
課堂參與度 |
30% |
Class material preview and class participation |
2. |
期中考 |
30% |
Open-book 個別 online 口試 |
3. |
期末報告 |
40% |
期末書面暨口頭報告 |
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針對學生困難提供學生調整方式 |
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上課形式 |
提供學生彈性出席課程方式 |
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作業繳交方式 |
學生與授課老師協議改以其他形式呈現 |
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考試形式 |
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其他 |
由師生雙方議定 |
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週次 |
日期 |
單元主題 |
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第1週 |
2023/2/22 |
Semiconductor electronics product engineering overview, Ch 1 |
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第2週 |
2023/3/1 |
Overview of process/device technology, Ch 2-3
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第3週 |
2023/3/8 |
Device engineering fundamentals and Q&R fundamentals, notes/HBs
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第4週 |
2023/3/15 |
Wire; CMOS inverter, Ch 4-5
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第5週 |
2023/3/22 |
Combinational logic, Ch 6 |
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第6週 |
2023/3/29 |
Sequential logic, Ch 7; Product implementation strategies; interconnect, Ch 8-9 |
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第7週 |
2023/4/5 |
國定假日 |
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第8週 |
2023/4/12 |
校定Midterm exam week
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第9週 |
2023/4/19 |
Timing issues, Ch 10
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第10週 |
2023/4/26 |
Data path structures, Ch 11 |
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第11週 |
2023/5/3 |
Memory/Array structures, Ch 12
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第12週 |
2023/5/10 |
Introduction, Design for testability, VLSI Ch 1-2
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第13週 |
2023/5/17 |
Automatic test pattern generation fundamentals. VLSI Ch 4 |
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第14週 |
2023/5/24 |
Product failure diagnosis fundamentals, VLSI Ch 7-8
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第15週 |
2023/5/31 |
Product debug fundamentals and practices, notes/SOC Ch 10
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第16週 |
2023/6/7 |
Oral presentation and written report due
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